BGA/SMT Rework Machine "RD-500III"
[Parts Repair/Repair/Reimplementation] Stable and safe rework operations, standard solder and lead-free solder, compatible with large and small circuit boards, large and small devices!
The "RD-500III" is a rework system that supports stable and safe rework operations, lead-free solder, eutectic solder, large substrates (up to 500×600mm), and various devices. The top heater and bottom heater utilize high-performance, high-efficiency high-power hot air heaters, ensuring stable and safe heating of the joints. 【Features】 ■ Flash memory controller → Does not require moving parts such as hard disks or cooling fans ■ Three heating systems optimal for lead-free applications ■ Two cooling modes tailored to the application ■ Two-point auto profile for device temperature control ■ Integrated functions from solder printing to device setting 【Applications】 - Tablets - Computer motherboards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, etc. *For more details, please request materials or view the PDF data available for download.
- Company：デンオン機器
- Price：Other
